According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone's processor. “Tiny pipes inside the phone are filled with a liquid coolant, which circulates around the heat-producing components like the chipset and then away, taking excess heat with it,” Slash Gear reported. Because space is limited in smartphones, … [Read more...]
Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems
SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP) program focused on the development of high effective conductivity (keff >1000W/mK), low … [Read more...]
An Introduction to Pulsating Heat Pipes
Modern electronics thermal management faces considerable challenges in the wake of component miniaturization, which has led to higher demands on net heat flux dissipation. With the industry closely following Moore's Law, the future demands are becoming increasingly more challenging [1]. Two-phase passive devices are proven present day solutions. Conventional heat pipe … [Read more...]
