The fundamental problem in creating efficient thermoelectric materials is that they need to be good at conducting electricity, but not at conducting thermal energy, say Massachusetts Institute of Technology (MIT) researchers. That way, one side can get hot while the other gets cold, instead of the material quickly equalizing the temperature. But in most materials, electrical … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
"Revolutionary" New Thermal Management Materials
Editors tend to frown on use of "revolutionary" in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with low coefficients of thermal expansion (CTEs) and thermal conductivities higher than that of copper (400 W/m K), and a score with thermal conductivities at least … [Read more...]
High performance thermal management materials
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of thermal expansion Extremely high strength and stiffness Low densities Low cost, net shape fabrication … [Read more...]
