A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
A Practical Implementation Of Silicon Microchannel Coolers
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were very high. As chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. Due to … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
