Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Novel Thermally Enhanced Power Package
In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, … [Read more...]
IMAPS Honors Member with President’s Award
Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with IMAPS’ 2010 President’s Award for dedicated efforts in ensuring a successful reorganization of the IMAPS Microelectronics Foundation and increasing its financial resources. IMAPS (International Microelectronics and Packaging Society) is the largest society dedicated to the advancement and growth of … [Read more...]
Advanced Techniques for IC Surface Temperature Measurement
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard to the microelectronic evolution is thermal management/analysis, which proves essential in the domain of IC design to prevent reliability … [Read more...]
The Many Flavors of Ball Grid Array Packages
By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price. The main driver for these trends has been the increasing integration of more functions on a single chip. In spite of its greater performance, the PC of today has far … [Read more...]
