Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips, according to a research paper appearing online in the International Journal of Heat and Mass Transfer. Written by mechanical engineering doctoral … [Read more...]
Product & Industry News
Mitsubishi Adds LED-Based Cube to Display Wall Line-up Mitsubishi Digital Electronics America’s Presentation Products Division has expanded its SeventySeries display wall line with the SeventySeries: LED, an LED-based, rear-projection display wall cube designed specifically for control and command rooms for government, traffic and utility facilities, and network operations … [Read more...]
Forced-Air Enclosure for Conduction-Cooled Embedded Computing Boards
Extreme Engineering Solutions (X-ES) in Middleton, Wis., is introducing the 8.8 pound XPand4200, a sub-half-ATR, forced-air-cooled enclosure for conduction-cooled modules for embedded computing in vetronics and avionics applications in unmanned aerial vehicles (UAVs), helicopters, fixed-wing aircraft, armored vehicles, and unmanned ground vehicles (UGVs). Electronics thermal … [Read more...]
Challenges In Thermal Control Of Military Electronics Systems
Thermal design engineers working in defense electronics are facing many challenges, some of which have been around for a long time and some that are more recent. Worldwide climatic extreme temperatures are reasonably constant and there are many military electronic systems that function in these extremes. As a result, there is significant design history available for … [Read more...]
