The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to maintain the strong positions that Europe’s semiconductor and electronics equipment companies have achieved in … [Read more...]
Modeling Multiple Heat Source Problems In Electronic Systems
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts (such as, we have already attained a level of power density that is comparable to nuclear power stations) would not … [Read more...]
Providing More Value Than Playing Video Games
ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original promise. The last word in the mission statement is value, and each of us, as a thermal engineer, desires to add value to our projects. Admittedly, … [Read more...]
Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting on a fin and the dimensions of the fin, the thermal resistance of an individual fin is given by: where Af and η are the surface area and … [Read more...]
Natural convection modeling of heat sinks using web-based tools
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
