Authors Johannes van Es and Henk Jan van Gerner, National Aerospace Laboratory NLR, The Netherlands The next generation military platforms will be equipped with more and more powerful sensors and avionics. The increasing power densities in electronic subsystems demand more cooling power while survivability requirements limit the possibilities for extending or adding … [Read more...]
Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems
SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP) program focused on the development of high effective conductivity (keff >1000W/mK), low … [Read more...]
integrating vapor chambers into thermal solutions
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
