Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, & Yogendra K. Joshi Banafsheh Barabadi Department of Mechanical Engineering Massachusetts Institute of Technology 77 Massachusetts Ave. Cambridge MA 02139 Yogendra K. Joshi Satish Kumar G.W. Woodruff School of Mechanical Engineering Georgia Institute of Technology 801 Ferst Dr, Atlanta GA 30332 Valeriy … [Read more...]
On-site Cogeneration for Reducing Data Center Primary Energy Use
Dustin W. Demetriou, PhD Email: dwdemetr@us.ibm.com As most readers are aware, the data center industry has put an increased focus on energy efficiency and environmental impact. Data centers in the United States are estimated to consume nearly 2% of the total electricity. The de facto metric used in the data center industry to evaluate energy efficiency has been the Power Usage … [Read more...]
An Additive Design Methodology for Heatsink Geometry Topology Identification
Introduction Established heatsink manufacturing processes such as extrusion, casting and milling constrain the achievable topology and geometry of the heatsink. The advent of metallic 3D printing (additive manufacture) processes such as selective laser melting (SLM) may remove many of these constraints, forcing the designer to reconsider the approach taken to determine a … [Read more...]
Heat Pipe Integration Strategies for LED Applications
Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste heat. If this thermal energy is not properly dissipated, the resulting high operating temperatures lead to reduced brightness, shift … [Read more...]
Heat Pipes for Electronics Cooling Applications
Figure 1: Heat pipe operation Introduction All electronic components, from microprocessors to high end powerconverters, generate heat and rejection of this heat is necessary for theiroptimum and reliable operation. As electronic design allows higher throughputin smaller packages, dissipating the heat load becomes a critical design factor. Many of today's electronic devices … [Read more...]
