Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures are most commonly used to provide the capillary path for the liquid return to evaporation section; these are sintered powder, screen mesh and grooved … [Read more...]
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Use Of Heat Pipe Cooling Systems In The Electronics Industry
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use air and liquid coolers as well as coolers constructed on the principle of the phase change heat transfer in closed space; i.e., … [Read more...]
