In its 28th year, SEMI-THERM will include Invited Speakers, Technical Sessions, Short Courses and an Evening Tutorial as well as vendor exhibits and dedicated vendor sessions for the latest in commercial offerings. SEMI-THERM actively solicits student papers and awards travel stipends and reduced conference fees. Those papers deemed to be among the best in the conference will … [Read more...]
IEEE Components, Packaging and Manufacturing Technology Society
The CPMT Society, as the principal sponsor of SEMI-THERM, invites professionals to consider joining the organization for networking, learning, and career development. Access SEMI-THERM papers from 1988 to 2010 at ieeexplore.ieee.org, using the Xplore search capabilities. Visit the group at Booth 108. Learn more. … [Read more...]
30 GHz Leadless Chip Carrier Packaging Platform
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]
Thermal Company Partners With Packaging Services Firm
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
Thermal Paper Draws Top Award at PCIM Conference
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals (under 35 years old). Andreas Munding of Liebherr-Elektronik GmbH and his co-authors were recognized for their paper, … [Read more...]
