Editor’s Forward: The ITEM Media team has launched our brand new Electronics Cooling website today! Take a look around – the new layout is responsive with easier navigation and encourages user interaction, with many new features still to come! We are very interested in your feedback, so please use the form below this week’s blog post to log in and post your … [Read more...]
Apple Files Patent for Smaller, Quieter Wireless Cooling Fan
A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain components limit how thin and light the company can make their devices. One such component is the cooling fan, an essential thermal management … [Read more...]
Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to background information supplied by the inventors, “there are proposed various heat spreaders for spreading heat generated from an IC chip mounted on an IC … [Read more...]
Patent for Thermal Interface Material with Thin Transfer Film or Metallization
The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA. According to background information provided by the inventors, the patent covers, “a thermal interface material assembly comprising: a thermal interface material having a first side and … [Read more...]
Patent Awarded for Free Cooling Solution for a Containerized Data Center
The U.S. Patent and Trademark Office has awarded patent No. 8,554,390, “Free Cooling Solution for a Containerized Data Center,” to the International Business Machines Corporation in Armonk, N.Y., USA. “There is a problem in that the cost of operating today's data centers continues to rise and come under closer and closer scrutiny,” the inventors explain in their summary. … [Read more...]