The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
New Patent Covers System for Clamping Heat Sink
The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent covers “a system for clamping a heat sink that prevents excessive clamping force. The system may include a heat sink, a semiconductor … [Read more...]
