By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price. The main driver for these trends has been the increasing integration of more functions on a single chip. In spite of its greater performance, the PC of today has far … [Read more...]
Parameters affecting package thermal performance a low end system level example
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power trends seen in the 1980s for the bi-polar circuits [3] but with a time shift by a decade. It is a fortunate circumstance that a tremendous amount of heat transfer … [Read more...]
