Co-authored by: Nitesh Kumar Sardana, Susyamala Pavan Kumar Busam, Dr. Laxmidhar Biswal Robert Bosch Engineering and Business Solution Pvt. Ltd. Abstract The market demand for lightweight and cost effective electronic products with multi-functional operations leads to the introduction of plastic housing and high current density on board. In general, automotive electronic … [Read more...]
Dual Channel Kits for High Capacity and Performance DRAM Modules
ADATA Technology Co., Ltd. announced a boost to its XPG™ Xtreme Series DDR3 lineup with 2133X 8GB and 16GB dual channel kits. The new ADATA XPG Xtreme Series DDR3 2133X runs at 2133 MHz and an operating voltage of 1.65 volts with latency settings of 10-11-11-30, allowing for predicted bandwidth up to 34.1GB per second. Each XPG memory chip is selected through a strict … [Read more...]
40 GHz Bandwidth Socket for 16x16mm, 0.8mm Pitch BGA Packages
Ironwood Electronics’ new high performance BGA socket product line uses elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9006 socket is designed for 16X16 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is also designed to dissipate few watts with compression … [Read more...]
Low Resistance Connector with Silicone Core
Fujipoly’s Zebra® Gold 8000C Series product is constructed from a low durometer silicone core that is covered with 166 parallel rows of flat, gold-plated wires per inch. This construction allows the connector to accommodate PCBs with pad center spacing down to .020”. In addition, each .001” x .003” gold-plated copper element delivers a current carrying capacity of 250mA while … [Read more...]
creating PCB thermal conductivity maps using image processing
Byron Blackmore Mentor Graphics Corporation Introduction Thermal conduction into a printed circuit board (PCB) is often an important part of the critical heat transfer path in electronic devices. Efficiently capturing the effect of the heterogeneous and anisotropic nature of the PCB’s copper distribution on local thermal resistance in a simulation has long been a goal of the … [Read more...]
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