The Toyota Research Institute of North America (TRINA), Electronics Research Department (ERD), is seeking research proposals on two technical topics. Application can be found below TRINA, established in 2008, is a R&D center of Toyota located in Ann Arbor, Michigan. TRINA aims to strengthen Toyota's advanced research function throughout … [Read more...]
Breakthrough Thermal Material System to Enable Faster Computing
Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]
Heat of Vaporization
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
Use Of Heat Pipe Cooling Systems In The Electronics Industry
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use air and liquid coolers as well as coolers constructed on the principle of the phase change heat transfer in closed space; i.e., … [Read more...]
Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
All phase change thermal interface materials are designed to minimize the thermal resistance in an interface between a heat generating component and a heat sink. How well they achieve this goal in a specific application depends on how judiciously their phase change characteristics are matched to the interface specifications. The purpose of this paper is to present the results … [Read more...]
