Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty materials, plus Gap Pad®, gap filling materials, phase change materials, and Bond-Ply®. Learn more … [Read more...]
Low Resistance, Zero Pump-Out Thermal Pad
AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal grease on either side of a 2 mil aluminum foil substrate. Learn more from AOS … [Read more...]
Phase Change Material Thermal Properties
Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink. One effective method of increasing thermal capacitance is to include a material that undergoes a change of … [Read more...]
Thermal management of outdoor enclosures using phase change materials
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and deployed such as broadband ISDN, cellular and/or cable, heat dissipation densities will increase substantially [1]. Furthermore, the introduction … [Read more...]
