Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications. THERCOBOND™ materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal … [Read more...]
Thermomechanical stress modeling in microelectronics and photonics
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated with mechanical (structural) failures (e.g., ductile rupture, brittle fracture, failures due to fatigue, … [Read more...]
