Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic … [Read more...]
Thermal Paper Draws Top Award at PCIM Conference
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals (under 35 years old). Andreas Munding of Liebherr-Elektronik GmbH and his co-authors were recognized for their paper, … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
A Few Design Techniques On How To Reduce The Power
There will always be the need to get heat out of high power circuitry, but with a little extra design effort up front, we may be able to reduce overall power needs. Here are two techniques that can help do that. Turn Idle Circuits Off A circuit that is not always used can be turned off until needed. This is a technique widely used in battery powered electronics, but it can be … [Read more...]
