The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple shapes, such as cubical metal blocks simulating electronic components, often exhibit multi-dimensional flow phenomena that include … [Read more...]
Conduction heat transfer in a printed circuit board
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated structure is illustrated in Figure 1. The Figure indicates the numbering system that will be used for indicating the different layers, numbered 1 through to … [Read more...]
