In the last decade, we've come a long way in the application of thermal analysis to the design of electronics. And there's no sign of the pace of innovation changing. Engineers are still being challenged to build faster, smaller and cheaper products in ever-decreasing design times. Fortunately, the engineering software industry has been able to respond by providing tools that … [Read more...]
Thermal characterization of active components
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment) were evaluated by component suppliers. The methods were improved for practical application and extended to a large … [Read more...]
