Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
Groups Develop Thermal Nanotape for Packaging
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
LED Lighting Reference Designs with IC Houses
Working closely with various IC manufacturers, Wurth Electronics Midcom released several new transformers and inductors designed for LED lighting applications. These components maximize operational efficiency while maintaining a compact size for small form factor circuit board construction. All transformers for these semiconductors are designed for low leakage inductance. This … [Read more...]
Analysis System Ensures Optimal Heat Sink Efficiency
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers can visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting … [Read more...]
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