Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon 100GR-FL will transfer heat with a … [Read more...]
Austrian Company Acquires Electronic Component Producers
Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics. EBG, based in Styria, Austria, is a specialist in passive electronic components, such as high-voltage, high-performance resistors, and generates annual sales of €30 million. DAU is … [Read more...]
transient dual interface measurement of the rth-jc of power semiconductor packages
Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a device can be used in a specific application and a low Rth-JC is a competitive advantage for the semiconductor manufacturer. … [Read more...]
IC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and thermal specialists alike, FloTHERM IC offers the ease-of-use of Smartpart technology combined with the power of FloTHERM to greatly boost productivity … [Read more...]
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to maintain the strong positions that Europe’s semiconductor and electronics equipment companies have achieved in … [Read more...]
