Scientists at the European Synchrotron Radiation Facility (ESRF) are using X-ray diffraction to thoroughly understand a new type of nanostructure -- square arrays of germanium (Ge) pillars that have very complex geometries and physical attributes. Germanium grown epitaxially on micrometre-sized silicon pillars forms perfect crystals free of defects. The resulting Ge/Si … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
30 GHz Leadless Chip Carrier Packaging Platform
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]
Breakthrough Thermal Material System to Enable Faster Computing
Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
