Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2]. The enhanced thermal conductivity, low density, low cost, ease of manufacture and corrosion resistance of polymer … [Read more...]
Tech Brief: Visualization of Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins
Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high heat fluxes from electronic packages such as 3D stacked chips. Flow boiling in microchannel arrays has been employed in many applications[1-3], and boiling … [Read more...]
Effective Heat Spreading Angle
Dirk Schweitzer, Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany dirk.schweitzer@infineon.com Introduction To accurately compute the thermal resistance of a layered structure, such as the Junction-to-Case thermal resistance of a power semiconductor, the heat spreading inside the structure has to be considered. The calculation of the spreading resistance is … [Read more...]
An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits
By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate thermal integrity of the packages and cooling solutions [1]. In advanced silicon technologies (sub-45nm nodes), the chip’s thermal … [Read more...]
Metal Foam-PCM: Heat Storage Technology: The Thermal Charging Scenario
For optimal operation of electronics, the generated heat must be removed and hot spots must be mitigated. If the junction temperature increases above a specified limit, some electronic components may fail, or experience a decline in performance. Excess temperature also causes thermal stresses that lead to fracture of electronic packages. Phase change materials (PCMs) are … [Read more...]
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