IP to the Pin is a software technology that will significantly influence automated test in the coming one to three years, according to National Instruments’ 2011 Automated Test Outlook, a view of key technologies and methodologies impacting the test and measurement industry. Sharing FPGA IP between design and test will dramatically shorten design verification/validation and … [Read more...]
System Measures Pressure Distribution between Heat Sinks, Components
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound effect on cooling efficacy. If the … [Read more...]
product & industry news
Ultra-Thin Waterproof Piezoelectric Speaker Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The speaker achieves IPX7 grade waterproof protection without the need of a waterproof … [Read more...]
High-Accuracy 2.25 V Digital Temperature Sensor with Dual Alarm
STMicroelectronics has announced a super-small and power-efficient temperature sensor allowing portable devices to benefit from features such as intelligent thermal protection. ST’s new STTS751 Digital Temperature Sensor (DTS) is mounted on the circuit board to feedback accurate temperature data allowing the system to manage its temperature, for example, by activating a … [Read more...]
Reliability Testing Of Thermal Greases
Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM solutions include adhesives, greases, gels, phase change materials, pads, and solder alloys. Most TIMs consist of a polymer matrix, such as an … [Read more...]