Power IQ 2.0 Energy Management software provides Thermal Analytics for monitoring rack temperatures based on industry guidelines. Trending reports and cumulative totals can be displayed at the data center, floor, room, rack, customer and IT device level. Power IQ also features: vendor agnostic centralized monitoring agentless graceful OS shutdown outlet control powerful … [Read more...]
The Uses of Simplicity in Thermal Analysis
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system complexity; 2) increased power dissipation; and 3) enhanced software tools and computing performance. The first two we put into the challenge category. They … [Read more...]
IC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and thermal specialists alike, FloTHERM IC offers the ease-of-use of Smartpart technology combined with the power of FloTHERM to greatly boost productivity … [Read more...]
Use of Power Law Regression in Packaging Thermal Calculations
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such as ΘJA (junction-to-ambient thermal resistance), for specific IC package designs on the basis of limited data. These metrics are in … [Read more...]
Simple Formulas for Estimating Thermal Spreading Resistance
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source and a sink with different cross-sectional areas. Examples of two situations involving spreading heat flow are shown in Figure 1. One example is that of a chip mounted on the bottom … [Read more...]
