T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is critical for design success. As with other family members in the L37 series the product is available in a range of thicknesses, with or without an adhesive … [Read more...]
Thermal Management PCBs Solve Thermal Problems for LED Industry
SinkPAD Corporation’s new SinkPADTM aluminum PCB technology are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications. SinkPADTM conducts heat out of the LED system (LED conduction cooling) by enabling a direct thermal path between the LED and surrounding atmosphere. The LED thermal … [Read more...]
Thermally Conductive Grease Used for Solar Industry
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2). It provides high thermal conductivity and low thermal resistance for applications where … [Read more...]
Silicone Putty Thermal Interface Material
Fujipoly’s Sarcon® XR-v-AL is a uniquely formulated silicone thermal interface material that offers the installation flexibility of a putty-like sheet. Sarcon® XR-v-AL provides a thermal conductivity of 6.0 W/m°K and thermal resistance of just .04 °Cin2/W. The non-flammable, peel-and-stick interface material is .11mm thick. Learn more from Fujipoly. … [Read more...]
New Grade of Thermal CVD Diamond Material
Element Six has announced the commercial availability of DIAFILM 200, a diamond thermal material that can offer users thermal conductivity in excess of 2000W/mK. This grade of CVD (chemical vapor deposition) diamond thermal material is targeted for advanced users that work with high power, or high power density devices, and require extreme performance for their thermal … [Read more...]
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