Taica’s Alpha Gel’s softness and conformity help minimize heat resistance and stress on critical devices in electronics. K thermal-conductivity material is available, facilitating heat dissipation results. The gel retains the softness and tackiness of its base material. It adheres to rough surfaces, easily compressed, and air gaps could be driven out for efficient thermal … [Read more...]
Researchers Developing Silver-Diamond Thermal Shim
Researchers at the Georgia Tech Research Institute are developing a solid composite material, made of silver and diamond to cool small, powerful microelectronics used in defense systems. The diamonds provide the bulk of thermal conductivity, while the silver suspends the diamond particles within the composite and contributes to high thermal conductivity. The research is … [Read more...]
Thermal Facts and Fairy Tales: Published Thermal Conductivities Values: Facts or Fairy Tales?
Around 1980, when I joined the Heat Transfer Group at Philips CFT, my boss threw a piece of material on my desk and asked for its thermal conductivity. It took me a week digging in literature to discover that this was no easy question to answer, despite the simple mathematics behind a steady state measurement: k=q/∆T/A, with k the thermal conductivity, q the dissipation, ∆T the … [Read more...]
New Book on Thermal Computations for Electronics
Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling by Gordon Ellison is a total revision of his previous work on the subject. This text helps readers understand and master mathematical calculation, prediction and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Addresses topics such as … [Read more...]
Cooling High-Power Electronic Components in Small Packages
Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance found in solid heat sink construction, which enables lower device temperature and greater component reliability. The chamber features effective thermal conductivity over 5,000 W/mK; application improvement of over 30% in high-flux, poor spreading applications; and over … [Read more...]
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