Byron Blackmore Mentor Graphics Corporation Introduction Thermal conduction into a printed circuit board (PCB) is often an important part of the critical heat transfer path in electronic devices. Efficiently capturing the effect of the heterogeneous and anisotropic nature of the PCB’s copper distribution on local thermal resistance in a simulation has long been a goal of the … [Read more...]
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap … [Read more...]
Thermal Facts and Fairy Tales: Uncertainty is Assured
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of a printed circuit board had determined that a thermal interface material was needed under some hotter components to provide a better conduction path. The circuit card was edge cooled … [Read more...]
High-Performance Thermal Putty
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier … [Read more...]
Technical Data Summary
ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging and as a result, this column will evolve into additional topics. … [Read more...]
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