Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
The Role of Natural Graphite in Electronics Cooling
Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of this brief, natural graphite. The basic structure of graphite is shown in Figure 1. Figure 1. Structure of graphite crystal. The … [Read more...]
Thermal interface under a plastic quad flat pack
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic packages require a large-area solid heat sink in order to transfer the heat into the copper thermal lands on the printed … [Read more...]
