The global market for Electronic Thermal Management is forecast to reach $8.6 billion by 2015, according to market research company Electronics.ca Publications. Factors driving growth include developments in technology and marked increase in the production of miniaturized microprocessors. Further, increased use of mobile devices is likely to impact market growth. In the … [Read more...]
Computers that Recycle Energy among Top IT Innovations
Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in IBM labs and around the world. On-chip water-cooling systems could be used to utilize thermal energy from a cluster of computer processors to provide hot water for an … [Read more...]
Software Modeling to Determine Heat-Related Problem Spots
Managing heat generation and dissipation in today’s compact and complex electronic world requires the attention of designers and manufacturers alike. It is also a system-wide problem, because optimizing a thermal problem in one area—whether it’s package, board or enclosure—rarely ensures the entire system will be optimized. Past techniques to determine heat-related problem … [Read more...]
Military Electronics Thermal Management Challenges Spark Innovation
Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight spaces creates major heat dissipation problems, an example of how size, weight, and power (SWaP) constraints … [Read more...]
thermal facts and fairy tales: fully-developed channel flow: why is Nu constant?
Clemens J.M. Lasance Philips Research Laboratories Emeritus The last time the subject of my column was: ‘Most of us don’t live in wind tunnels, neither in the world of Nusselt.’ I promised more comments about the (mis)use of the heat transfer coefficient h in real-life applications where we are dealing with multiple sources, anisotropic PCBs and multilayers. In this column … [Read more...]
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