Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]
New Catalog Released
Fujipoly announces an Aug. 16 release date for its new Thermal Interface Material and Elastomeric Connector product catalog. The free 52-page product overview and technical design guide includes installation suggestions, as well as detailed thermal performance and electrical conductivity data points. Several new pages of high-performance and low-cost thermal materials have … [Read more...]
