Daat Research’s CoolitDC handles complex facility shapes, raised floors, drop ceilings, room partitions, support columns, under floor pipes, cables and obstructions, furniture and other infrastructure components. It also accounts for room ventilation components such as fans, ducts and vents. The user interface takes full advantage of drag and drop operation. Thermal models are … [Read more...]
SpaceClaim Signs OEM Contract with C&R Technologies
C&R Technologies (CRTech) has chosen SpaceClaim to be integrated within the CRTech family of products. CRTech SpaceClaim will address complexities in creating thermal models by enabling users to import CAD parts and assemblies from many CAD formats to simplify and heal the geometry and then send it on for meshing. CRTech SpaceClaim will also enable engineers to modify the … [Read more...]
Thermal Modeling Approaches Of GaAs Semiconductors
Introduction Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to provide expeditious and accurate answers to trade studies regarding various FET layouts and geometry, metallization schemes, and conduction … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers of the board; and some is dissipated by convection and radiation from the exposed surfaces. There has long been a focus on characterizing the … [Read more...]
