During the development of a telecommunications product, an unpredictable phenomenon of air streams within the maze of cards and module was encountered. It could only be compared to suddenly confronting powerful inner streams in a calm ocean. Unlike the ocean, however, these streams appeared in a man-made machine. It seemed as if someone had rewritten the laws of physics. It was … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
Integrated thermal network models are still useful
Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the need to predict integrated systemperformance on the basis of the individual component … [Read more...]
