Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power trends seen in the 1980s for the bi-polar circuits [3] but with a time shift by a decade. It is a fortunate circumstance that a tremendous amount of heat transfer … [Read more...]
High performance thermal management materials
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of thermal expansion Extremely high strength and stiffness Low densities Low cost, net shape fabrication … [Read more...]
