JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published JESD51-14 standard is titled “Transient Dual Interface Test Method for the Measurement of the Thermal Resistance … [Read more...]
An alternative approach to junction-to-case thermal resistance measurements
As more and more integrated circuits dissipate power at levels once reserved for power discrete devices, junction-to-case thermal resistance (JC or RJC) remains as important as ever. The difficulties in making JC measurements often leads to values that do not accurately indicate true junction temperature (TJ). The measurement difficulties are usually two-fold. First is … [Read more...]
