Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping or damaging the … [Read more...]
Graphics Card with Thermal Design Offers Quiet Performance
Graphics card and mainboard manufacturer MSI recently unveiled its N560GTX-Ti Twin Frozr II/OC graphics card featuring the Twin Frozr II Thermal Design. An appraisal by BenchmarkReviews.com determined that “the Twin Frozr II cooling system is a well proven package that kept the GF104 GPU quite cool, even during stress testing.” The thermal interface material (TIM) was very … [Read more...]
Making Sure Your Chips Don’t Burn
Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
Packaging Challenges For High Heat Flux Devices
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]
