Morgan Technical Ceramics is providing ceramic components for three water cooling pumps that will be used in hybrid and electric vehicles to cool the high energy battery, the cabin heater and the power electronics loop that drives the vehicle. Ceramic gives high quality performance in harsh environments where aggressive glycol coolants are used. This makes it ideal for the … [Read more...]
Computers that Recycle Energy among Top IT Innovations
Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in IBM labs and around the world. On-chip water-cooling systems could be used to utilize thermal energy from a cluster of computer processors to provide hot water for an … [Read more...]
Compact Water-Circulation System Prevents Stacks of Electronic Chips
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from microchips to maintain a temperature within acceptable limits: less than 100 °C,” explains team-member Navas Khan from the Institute of … [Read more...]
Thermal Paper Draws Top Award at PCIM Conference
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals (under 35 years old). Andreas Munding of Liebherr-Elektronik GmbH and his co-authors were recognized for their paper, … [Read more...]
Back to the Future with a Liquid Cooled Supercomputer
Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable operation of successive generations of computers. In many instances the trend toward higher circuit packaging density to provide reductions in circuit delay … [Read more...]
