Sponsored by ANSYS
Determine the Thermal Signature of an Electronic System
As electronic devices become smaller, denser and faster, the structural and thermal integrity of their electronic packages and printed circuit boards (PCBs) becomes more critical. Heat affects the performance and reliability of integrated circuits (ICs) and may cause failure. Keep things running cool with the ANSYS Chip-Package-System (CPS) design flow. It enables package and system designers to quickly and easily solve their electrothermal challenges. Simulation software tools can accurately predict the performance of chips, packages and systems and detect problems before a product goes to market. They provide end-to-end solutions for engineering organizations, helping everyone from the architect to the system integrators.
ANSYS CPS enables you to:
- Collaborate more effectively with other electrical and mechanical engineers, from concept design through manufacturing and reliability testing
- Design a PCB that doesn’t experience failure resulting from temperature rise, thermal expansion and external structural loads
- Perform direct current (DC) joule heating stress analyses to determine the mechanical reliability of electronic components
- Choose the complexity of the thermal simulation by adding or subtracting heat sources, air flow direction and speed and many other factors
- Analyze DC drop, current density, via currents and power density to determine if a PCB’s design meets electrical requirements
- Determine your product’s size, weight and cost based on its materials, cooling and form factors
Interested in learning more? Take a look at ANSYS’s whitepaper: Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages.
