Sponsored by Cradle
Learn just how easy it is to use PICLS with our PICLS – At a Glance Webinar!
Cradle PICLS is designed to deliver high capability at low cost with minimal difficulty so that more PCB designers can undertake thermal analyses and achieve better product design. Use PICLS to rearrange components on a PCB and immediately see thermal transfer and changes to temperature distributions. PICLS models multi-layer PCBs, foil thickness, and thermal vias. Output results as a report or seamlessly import them into Cradle scSTREAM or HeatDesigner for system level analysis.
